Chemical-mechanical planarization--integration, technology and reliability; proceedings.

Symposium on Chemical-Mechanical Planarization; Integration, Technology and Reliability.

In these proceedings of the symposium of March 2005, participants describe their work in polishing, including the planarization process and its applications, including copper chemical mechanical polishing (CMP) and ceria slurries, consumables such as CMP pads and slurries, CMP equipment and metrology, CMP modeling and simulation, Invited paper topics include the relationship of CMP wafer nanotopography to groovescale slurry transport, the abrasive contribution to CMP friction, and an investigation on an abrasive-free copper chemical mechanical planarization.